Weeks after cancelling two generations of Atom mobile chips, Intel is paving the way for future low-power mobile technologies with a new research collaboration with a French atomic energy lab.

Fundamental research leading towards faster wireless networks, secure low-power technologies for the Internet of Things, and even 3D displays will be the focus of Intel’s collaboration with the French Alternative Energies and Atomic Energy Commission (CEA).

Intel and the CEA already work together in the field of high-performance computing, and a new agreement signed Thursday will see Intel fund work at the CEA’s Laboratory for Electronics and Information Technology (LETI) over the next five years, according to Rajeeb Hazra, vice-president of Intel’s data center group.

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