Tag Archive for: manufacturing

CommScope partners with Microsoft to help transform industrial manufacturing

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CommScope announced that it has collaborated with Microsoft to create a converged private wireless network solution, enabling new low-latency and mobile applications to transform industrial manufacturing.

CommScope successfully deployed the combined solution—using Microsoft Azure private MEC and CommScope CBRS access points—in its own manufacturing innovation center in Shakopee, Minnesota. Through this cloud-connected, low-latency private wireless network, CommScope is already improving both the operational efficiency and manufacturing agility of its facilities.

This solution brings augmented reality applications and cloud-based manufacturing tools to factory engineers. This includes immersive technology training, aggregated assembly line data, and real-time remote assistance to improve production ramp times and worker capabilities. CommScope also leverages its low-latency wireless network to mobilize testing equipment across the production line. As an example, specialized microscopes are now mobilized so fiber optic quality testing can be done anywhere in real time as opposed to pulling product off the line.

“CommScope is excited to work with Microsoft to enable the next generation of private wireless networks,” said Upendra Pingle, SVP Intelligent Cellular Networks, CommScope. “We have deployed Microsoft’s private MEC platform in combination with CBRS access points in our own manufacturing innovation center to improve operational efficiencies. Together, we are showcasing the immediate, real-world advantages of private networking in industrial manufacturing, as our combined solution paves the way for the evolution of private wireless networks and manufacturing.”

“We see a tremendous opportunity to transform workforce efficiency by making it easy to deploy and develop private wireless that can underpin agile factories,” said Shriraj Gaglani, GM for Azure for Operators at Microsoft. “We collaborated with CommScope to implement use cases that increase worker and production line efficiency, and to help incubate and inspire industry 4.0 transformations.”

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Manufacturing has become most popular target of hackers, says TXOne Networks

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TXOne Networks CEO Terence Liu speaks at the 2021 Hacks in Taiwan Conference. Credit: TXOne Networks

Bolstering operational technology (OT) security is a budding awareness among semiconductor suppliers, as the manufacturing industry has become the most popular target of hackers, according to Terence Liu, CEO of TXOne Networks.

‘Threat landscape has changed’

Ten years ago, few people cared about the manufacturing industry’s information security because hackers usually attacked financial and government sectors and no law pushed manufacturers to improve security, Liu said during a video interview with DIGITIMES Asia.

However, the “threat landscape” has changed, Liu said, citing a report released by IBM, which provides threat analysis and response services.

“Manufacturing replaced financial services as the top attacked industry in 2021, representing 23.2% of the attacks [IBM’s] X-Force remediated last year,” IBM said in the report in March. “Sixty-one percent of incidents at OT-connected organizations last year were in the manufacturing industry.”

The capital flow of hackers is harder to track now when their payments are made in virtual coins, Liu said.

OT akin to IT

As manufacturers are automating more production facilities, their OT networks have become similar to IT settings, meaning the two environments are no longer fully separated as in the pre-digital era, Liu said.

In the industry 4.0 era, the seclusion of OT systems is almost untenable as more production facilities – ranging from machines, and manufacturing execution systems, to cloud servers – become interconnected. The COVID-19 pandemic has also compelled manufacturers to open internal networks for remote workers, creating more opportunities for hackers, he observed.

Hackers usually ransom manufacturers in two ways. They may steal companies’ data related to clients and threaten to publish the data. Or, they may attack manufacturers’ OT systems to disrupt production activities. Manufacturers would suffer more losses if they halt operations longer, Liu said.

SEMI E187 specification

On August 3, 2018, TSMC encountered attacks by computer virus, “which affected a number of computer systems and fab tools in…

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Botnet Detection Market Analysis By Recent Trends, Developments In Top Manufacturing Technology And Regional Growth Overview And Forecast To 2029

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Botnet is an arrangement of PCs which is live on the internet. In most cases, the computers belong to private individuals who have no idea that their computers have been hijacked for this purpose. These PCs quietly send spam, vindictive data and infections to…

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Manufacturing Bits: Oct. 11

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IC security using AFMs
The National Institute of Standards and Technology (NIST) has developed a probe assisted doping technique (PAD), a technology that could help prevent counterfeit chips and electronic devices from entering the market.

PAD involves creating a unique ID tag on every chip using an atomic force microscope (AFM). Basically, an AFM system incorporates a cantilever with a tiny hard tip or needle. Using AFMs, ID tags are embedded into a device during the manufacturing process. The device is easily authenticated using RF, which in turn ensures a secure supply chain for components in critical systems, according to NIST.

PAD is one of many ways to prevent nefarious groups from developing counterfeit chips, which ultimately end up in systems of all types. It’s a big problem as the counterfeit chip market had a worldwide value estimated at $75 billion in 2019, according to Rambus.

Today, there are already well-entrenched security solutions in the IC market. For some time, the IC industry has used traditional non-volatile memory for secure code storage applications. This memory can store a few bits of authentication information for security purposes using electric-fuse (eFuse) or anti-fuse technology. This is one way to prevent counterfeit chips.

The current solutions may not always be full-proof, prompting the need for a new technology. For example, Multibeam is developing a security lithography technology. Basically, using multi-beam technology, Multibeam’s system can pattern and embed a unique ID inside each IC during fabrication. The system hard codes the ID at the silicon level, making it tamper-proof. The information can link to a secure database to store individual chip data.

NIST has another solution–PAD. In the PAD process, a vendor deposits a thin layer of aluminum atoms on a wafer. The wafer itself consists of chips based on a given design. All told, PAD produces customizable superlattices of p-n junctions on a semiconductor substrate, according to NIST. The diameter of the implanted region is no larger than 200nm.

Then, a vendor would make use of an AFM. The tip of an AFM pushes some but not all of the atoms down in the surface. Then, the wafer is…

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